®

3

OPA544

Top View

ABSOLUTE MAXIMUM RATINGS

Supply Voltage, V+ to V– ................................................................... 70V

Output Current ................................................................. See SOA Curve

Input Voltage .................................................... (V–) –0.7V to (V+) +0.7V

Operating Temperature ................................................. –40

°C to +125°C

Storage Temperature ..................................................... –40

°C to +125°C

Junction Temperature ...................................................................... 150

°C

°C

CONNECTION DIAGRAMS

NOTE: (1) Vapor-phase or IR reflow techniques are recommended for solder-

ing the OPA544F surface mount package. Wave soldering is not recommended

due to excessive thermal shock and “shadowing” of nearby devices.

V–

V

O

V+

V

IN

V

IN

123 4 5

+

–

Tab is connected

to V– supply.

5-Lead

Surface Mount

V–

V

O

V+

V

IN

V

IN

123 4 5

5-Lead TO-220

and

Stagger-Formed

TO-220

+

–

Tab is connected

to V– supply.

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

PACKAGE/ORDERING INFORMATION

PACKAGE DRAWING

PRODUCT

PACKAGE

OPA544T

5-Lead TO-220

315

OPA544T-1 5-Lead Stagger-Formed TO-220

323

OPA544F

5-Lead Surface-Mount

325