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TDA8024 Folha de dados(PDF) 25 Page - NXP Semiconductors |
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TDA8024 Folha de dados(HTML) 25 Page - NXP Semiconductors |
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25 / 29 page ![]() 2004 July 12 25 Philips Semiconductors Product specification IC card interface TDA8024 UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 9.8 9.6 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.8 0.5 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT361-1 MO-153 99-12-27 03-02-19 0.25 w M b p Z e 114 28 15 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A D y 0 2.5 5 mm scale TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1 A max. 1.1 |
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