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EXAMPLE STENCIL DESIGN

(R

) TYP

0.05

8X (1.55)

8X (0.6)

6X (1.27)

(5.4)

(2.34)

(2.34)

BASED ON

0.125 THICK

STENCIL

4218825/A 05/2016

PowerPAD SOIC - 1.7 mm max height

DDA0008A

PLASTIC SMALL OUTLINE

1.98 X 1.98

0.175

2.14 X 2.14

0.150

2.34 X 2.34 (SHOWN)

0.125

2.62 X 2.62

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:10X

SYMM

SYMM

1

4

5

8

BASED ON

0.125 THICK

STENCIL

BY SOLDER MASK

METAL COVERED

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES