0.1-µF and 0.01-µF

decoupling

capacitor pairs for

each VCC pin

100-

resistors are as close

as possible to the device

before vias to the top side to

tie to appropriate pins

THS789

SLOS776A – SEPTEMBER 2012 – REVISED DECEMBER 2015

www.ti.com

Layout Example (continued)

Figure 16. Bottom (Signal Termination and Power Decoupling) Layer Example

10.3 Thermal Considerations

The TMU package provides a thermally conductive heat slug at the top for connection to an additional heatsink.

The TMU can be placed into many different modes for optimization of performance versus power dissipation, and

a table has been provided to help determine the power required. The heat sink should be carefully considered in

order to keep the TMU temperature within required limits and to promote the best temperature stability. The TMU

time measurement drift with temperature is an excellent 0.1 ps/°C. A good heat sink design takes advantage of

the low temperature drift of the TMU.

32

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