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25LC256TE/P Folha de dados(PDF) 15 Page - Microchip Technology

Nome de Peças 25LC256TE/P
Descrição Electrónicos  256K SPI Bus Serial EEPROM
PDF  32 Pages
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Fabricante Electrônico  MICROCHIP [Microchip Technology]
Página de início  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

25LC256TE/P Folha de dados(HTML) 15 Page - Microchip Technology

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 2003-2013 Microchip Technology Inc.
DS21822G-page 15
25AA256/25LC256
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
1.27 BSC
Overall Height
A
–
0.85
1.00
Molded Package Thickness
A2
–
0.65
0.80
Standoff
A1
0.00
0.01
0.05
Base Thickness
A3
0.20 REF
Overall Length
D
4.92 BSC
Molded Package Length
D1
4.67 BSC
Exposed Pad Length
D2
3.85
4.00
4.15
Overall Width
E
5.99 BSC
Molded Package Width
E1
5.74 BSC
Exposed Pad Width
E2
2.16
2.31
2.46
Contact Width
b
0.35
0.40
0.47
Contact Length
L
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
–
–
Model Draft Angle Top
φ
–
–
12°
φ
NOTE 2
A3
A2
A1
A
NOTE 1
NOTE 1
EXPOSED
PAD
BOTTOM VIEW
1
2
D2
2
1
E2
K
L
N
e
b
E
E1
D
D1
N
TOP VIEW
Microchip Technology Drawing C04-113B



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