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LM3875 Folha de dados(PDF) 2 Page - Texas Instruments |
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LM3875 Folha de dados(HTML) 2 Page - Texas Instruments |
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2 / 29 page ![]() LM3875 SNAS083D – JUNE 1999 – REVISED APRIL 2013 www.ti.com Typical Application *Optional components dependent upon specific design requirements. Refer to the External Components Description section for a component function description. Figure 1. Typical Audio Amplifier Application Circuit Connection Diagram Figure 2. Plastic Package(1) - Top View See Package Number NDJ for Staggered Lead Non-Isolated Package or NDA0011B for Staggered Lead Isolated Package (1) The LM3875T package (NDJ) is a non-isolated package, setting the tab of the device and the heat sink at V− potential when the LM3875 is directly mounted to the heat sink using only thermal compound. If a mica washer is used in addition to thermal compound, θCS (case to sink) is increased, but the heat sink will be isolated from V −. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM3875 |
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