ADC12DL065CIVSSLASHNOPB datasheet(6/35 Pages) TI1

6 / 35 page

ADC12DL065

SNAS249D – MARCH 2005 – REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

VA, VD, VDR

4.2V

|VA–VD|

≤ 100 mV

Voltage on Any Input or Output Pin

−0.3V to (VA or VD +0.3V)

Input Current at Any Pin(4)

±25 mA

Package Input Current(4)

±50 mA

Package Dissipation at TA = 25°C

See(5)

ESD Susceptibility

Human Body Model(6)

2500V

Machine Model(6)

250V

Soldering Temperature, Infrared, 10 sec.(7)

235°C

Storage Temperature

−65°C to +150°C

Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(7)

(1)

All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be

limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies

with an input current of 25 mA to two.

(5)

The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by

TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula

PDMAX = (TJmax - TA )/θJA. In the 64-pin TQFP, θJA is 50°C/W, so PDMAX = 2 Watts at 25°C and 800 mW at the maximum operating

ambient temperature of 85°C. Note that the power consumption of this device under normal operation will typically be about 390 mW

(360 typical power consumption + 30 mW TTL output loading). The values for maximum power dissipation listed above will be reached

only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply

voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.

(6)

Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through 0Ω.

(7)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

Operating Ratings

(1) (2)

Operating Temperature

−40°C ≤ TA ≤ +85°C

Supply Voltage (VA, VD)

+3.0V to +3.6V

Output Driver Supply (VDR)

+2.4V to VD

CLK, PD, OEA, OEB

−0.05V to (VD + 0.05V)

Analog Input Pins

0V to 2.6V

VCM

0.5V to 2.0V

|AGND–DGND|

≤100mV

Clock Duty Cycle (DCS On)

20% to 80%

Clock Duty Cycle (DCS Off)

40% to 60%

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.

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