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Figure 27. PowerDIP24 Junction-Ambient thermal resistance versus on-board copper area.

Figure 28. SO24 Junction-Ambient thermal resistance versus on-board copper area.

Figure 29. Mounting the PowerSO Package.

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101112

Co pper Are a is on Bo ttom

Sid e

Co pper Are a is on To p Si de

sq . cm

ºC / W

On-Board Copper Area

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C o pp er A rea is o n T op S ide

sq. cm

ºC / W

On-Board Copper Area

Slug soldered

to PCB with

dissipating area

Slug soldered

to PCB with

dissipating area

plus ground layer

Slug soldered to PCB with

dissipating area plus ground layer

contacted through via holes