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CPC1978J Folha de dados(PDF) 1 Page - IXYS Corporation

Nome de Peças CPC1978J
Descrição Electrónicos  Low Drive Power Requirements
PDF  7 Pages
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Fabricante Electrônico  IXYS [IXYS Corporation]
Página de início  http://www.ixys.com
Logo IXYS - IXYS Corporation

CPC1978J Folha de dados(HTML) 1 Page - IXYS Corporation

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INTEGRATED CIRCUITS DIVISION
DS-CPC1978-R09
www.ixysic.com
1
e3
Characteristics
Features
1.85A
rms Load Current with 5°C/W Heat Sink
Low 2.3
 On-Resistance
800V
P Blocking Voltage
2500V
rms Input/Output Isolation
Low Thermal Resistance:
JC = 0.35 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Recognized Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1978 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 1.85Arms continuous load current with a
5°C/W heat sink.
The CPC1978 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Switching Characteristics
Parameter
Rating
Units
Blocking Voltage
800
VP
Load Current, TA=25°C:
With 5°C/W Heat Sink
1.85
Arms / ADC
No Heat Sink
0.75
On-Resistance (max)
2.3
Thermal Resistance,
Junction-to-Case,
JC
0.35
°C/W
3
-
4
+
12
Part
Description
CPC1978J
i4-PAC Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
CPC1978
800V Single-Pole, Normally Open
Power Relay


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