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16July2015/Version 5

LEM reserves the right to carry out modifications on its transducers, in order to improve them, without prior notice

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HO 60 .. 250-P series

PCB Footprint in mm.

Assembly on PCB

● Recommended PCB hole diameter

2.15 mm for primary pin

0.9 mm for secondary pin

● Maximum PCB thickness

2.4 mm

● Wave soldering profile

maximum 260 °C, 10 s

No clean process only

Insulation distance (nominal values):

d

Cp

d

CI

On PCB: A - B

18.85 mm

-

Between jumper and secondary pin

21.1 mm

20.9 mm

Between primary busbar and secondary pin

14.6 mm

-

Between primary busbar and jumper

-

8 mm

Between primary busbar and core

-

11.34 mm

Between core and secondary terminal

-

1.18 mm