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SP507 Folha de dados(PDF) 16 Page - Sipex Corporation |
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SP507 Folha de dados(HTML) 16 Page - Sipex Corporation |
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16 / 30 page ![]() 16 SP505/6/7APN/03 SP505, SP506, SP507 Application Note © Copyright 2000 Sipex Corporation ESD Protection and EMI Filtering It is now a requirement for networking equipment, in order to receive the European "CE" mark, to withstand a certain amount of environmental hazards. Among these are ESD and EMI immunity as well as EMI emissions, which is the equipment's own generation of electromagnetic interference. Electrostatic discharge and overvoltage transients are important to suppress in any system. The specification generally used for ESD immunity is EN61000-4-2 (formerly IEC1000-4-2), which specifies Air Discharge and Contact Discharge Methods. For "CE" approval, the acceptance level is generally "Level 2" per the IEC1000-4-2 specification, which is 4kV Air Discharge and 4kV Contact Discharge. While the SP505, SP506, and SP507 has reasonable handling withstand voltages built in the I/O structures of the device, external protection is always a good idea. One method of protection is incorporating TransZorbs™ or transient voltage suppression ICs, which are back-to-back Zener diodes connected on the line to ground. There are a variety of manufacturers such as Motorola, Siemens, Semtech, Protek Devices, and more. The key specifications are: 1) Reverse Standoff Voltage - normal circuit operating voltage. For RS-232, the maximum V RWM = 15V. 2) Peak Pulse or Transient Current - expected transient current. (I PP) 3) Reverse Breakdown Voltage - device begins to avalanche and becomes a low impedance path to ground for the transient. (V BR) 4) Maximum Junction Capacitance - loading capacitance of the diode structure. More capacitance will affect the total AC performance. (C J) A variety of transzorbs were tested and all perform well in the presence of ESD transients. For faster data rates such as V.11 and V.35 signals, low capacitance is important since an additional 50pF load could add 5ns to the transition time and affect the overall transmission rate. The Semtech LCDA15C-6 and Protek Devices SM16LC15C are especially designed for data communications because of the multichannel line support and the low junction capacitance. Figure 29 illustrates a TVS configuration using the Semtech LCDA15C-6 connected to the clock and data signals of the SP505, SP506 and SP507. The LCDAC-6 was chosen due to its low junction capacitance of 20pF, which are important for high speed clock and data lines. Protek's SM16LC15C can also be used as the junction capacitance is 25pF. However, the two TVS devices are not pin compatible. Protek's SM16LC15C contains protection for eight lines and has a straight-through pinout. One side of the SM16LC15C is grounded. The LCDAC-6 uses a 8-pin SOIC package as opposed to the 16-pin package with the SM16LC15C. Since two ICs are needed anyway for clock and data, the smaller package is usually preferred. Refer to each of the manufacturer's datasheet for details. Figure 30 illustrates a TVS configuration to the handshaking signals. As these signals are for control and indication, they do not usually switch at high speed. The junction capacitance for these devices are less critical. Figure 28. I-V Curve of a TVS diode Lower V RWM values can be selected instead of 15V. If the configuration is straightforward, using 5V to 8V V RWM values is fine for the driver outputs and receiver inputs. Using 5V V RWM on the driver is fine since the clamping occurs at the reverse breakdown voltage(V BR), which is 6V for most 5V transzorbs. However, during compliancy testing, the V.28 receiver may be subjected to 15V in order to test the input impedance. Applying a voltage exceeding the V RWM rating will affect the input current measurement and thus fail the impedance test. TransZorb is a trademark of General Semiconductor Industries. Vrwm Vrwm Ir Ir Vbr Vbr It It Vc Vc Ipp Ipp I V |
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