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SPT02-236DDB Folha de dados(PDF) 4 Page - STMicroelectronics

Nome de Peças SPT02-236DDB
Descrição Electrónicos  Automation sensor transient and overvoltage protection
PDF  12 Pages
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Fabricante Electrônico  STMICROELECTRONICS [STMicroelectronics]
Página de início  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPT02-236DDB Folha de dados(HTML) 4 Page - STMicroelectronics

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Characteristics
SPT02-236DDB
4/12
DocID024333 Rev2
Table 4. Thermal resistance
Symbol
Parameter
Value
Unit
Rth(j-a)
SMD thermal resistance junction to ambient, per diode
FR4 board, copper thickness = 35 µm, recommended footprint
230
°C/W
Zth(j-a)
SMD thermal transient impedance junction to ambient, per diode
tp = 15 ms, Tamb = 85 °C, recommended footprint
6.5
°C/W
Table 5. Electrical characteristics (TJ = 25 °C, unless otherwise specified)
Symbol
Diode
Name
Test conditions
Value
Unit
VRM
ALL
Reverse stand off voltage
IR = 200 nA
MIN
33
V
IR = 1 µA
MIN
36
IRM
ALL
Leakage reverse current
VRM = 36 V
(1)
1.
Voltage applied at the nodes of each diode
MAX
1
µA
VRM = 36 V,
TJ = 150 °C
MAX
5
µA
VBR
ALL
Reverse breakdown voltage
IR = 1 mA
MIN
38
V
TYP
41.4
V
VCL
ALL
Peak clamping voltage
IPP = 2 A,
tP = 8 /20 µs
MAX
46
V
TYP
44
V
RD
ALL
8/20µs dynamic resistance
TYP
0.5
Ω
αTALL
VBR Temperature sensitivity
(2)
2.
VBR @ TJ = VBR @25 °C x (1+ αT x (TJ - 25))
MAX
17
10-4 /°C
VCL
D1
Peak clamping voltage
IR = 0.3 A, L = 1 H,
VCC = 30 V
MAX
46
V
VF
D2
Forward drop voltage
IF = 300 mA
MAX
1.1
V



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