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LSM6DS3 Folha de dados(PDF) 95 Page - STMicroelectronics |
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LSM6DS3 Folha de dados(HTML) 95 Page - STMicroelectronics |
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95 / 100 page ![]() DocID026899 Rev 8 95/100 LSM6DS3 Soldering information 100 12 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and "Green" standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Leave "Pin 1 Indicator" unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com/mems. |
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