DocID023772 Rev 4

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STPTIC

Package information

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Figure 7. Recommended PCB land pattern for Flip Chip package (metal defined pads,

solder mask 25 µm larger)

Figure 8. Recommended PCB land pattern for Flip Chip PTIC (die size 650 x 1200)

170 µm

225 µm

260 µm

250 x 230 µm

250 x 500 µm

200 x 180 µm

200 x 750 µm

Solder mask

Metal defined pads

Solder mask

Metal defined pads

PTIC die size

650 X 1200 µm

250 x 230 µm

250 x 800 µm