www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(1.2)

(2)

10X (0.65)

10X (0.25)

(0.35) TYP

(0.75) TYP

(2.75)

(

) TYP

VIA

0.2

8X (0.5)

WSON - 0.8 mm max height

DSC0010B

PLASTIC SMALL OUTLINE - NO LEAD

4214926/A 07/2014

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:20X

1

5

6

10

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

METAL

UNDER

SOLDER MASK

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)