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PIC16CE623-20/P Folha de dados(PDF) 94 Page - Microchip Technology

Nome de Peças PIC16CE623-20/P
Descrição Electrónicos  OTP 8-Bit CMOS MCU with EEPROM Data Memory
PDF  108 Pages
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Fabricante Electrônico  MICROCHIP [Microchip Technology]
Página de início  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16CE623-20/P Folha de dados(HTML) 94 Page - Microchip Technology

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PIC16CE62X
DS40182A-page 94
Preliminary
© 1998 Microchip Technology Inc.
Package Type:
K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
* Controlling Parameter.
† Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
PCB Row Spacing
0.300
7.62
Number of Pins
n
18
18
Pitch
p
0.100
2.54
Lower Lead Width
B
0.013
0.018
0.023
0.33
0.46
0.58
Upper Lead Width
B1†
0.055
0.060
0.065
1.40
1.52
1.65
Shoulder Radius
R
0.000
0.005
0.010
0.00
0.13
0.25
Lead Thickness
c
0.005
0.010
0.015
0.13
0.25
0.38
Top to Seating Plane
A
0.110
0.155
0.155
2.79
3.94
3.94
Top of Lead to Seating Plane
A1
0.075
0.095
0.115
1.91
2.41
2.92
Base to Seating Plane
A2
0.000
0.020
0.020
0.00
0.51
0.51
Tip to Seating Plane
L
0.125
0.130
0.135
3.18
3.30
3.43
Package Length
D‡
0.890
0.895
0.900
22.61
22.73
22.86
Molded Package Width
E‡
0.245
0.255
0.265
6.22
6.48
6.73
Radius to Radius Width
E1
0.230
0.250
0.270
5.84
6.35
6.86
Overall Row Spacing
eB
0.310
0.349
0.387
7.87
8.85
9.83
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
R
n
2
1
D
E
c
eB
β
E1
α
p
A1
L
B1
B
A
A2
62X.bk Page 94 Tuesday, March 10, 1998 3:40 PM



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