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UCD3138A Folha de dados(PDF) 66 Page - Texas Instruments |
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UCD3138A Folha de dados(HTML) 66 Page - Texas Instruments |
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66 / 83 page ![]() Internal SGND Plane VIAS under Power Pad UCD3138A SLUSC66B – MARCH 2015 – REVISED MAY 2015 www.ti.com 7.3.2 Layout Example Figure 7-13. UCD3138A Layout Example Figure 7-14. UCD3138A Layout Example, Internal Plane 7.4 Power Supply Decoupling and Bulk Capacitors • Both 3.3 VD and 3.3 VA should have a local 4.7- μF capacitor placed as close as possible to the device pins. • BP18 should have a 1- μF capacitor. 66 Application, Implementation, and Layout Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: UCD3138A |
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