Improved Low-Power,

CMOS Analog Switches with Latches

10

______________________________________________________________________________________

* Contact factory for dice specifications.

**Contact factory for availability and processing to MIL-STD-883B.

_Ordering Information (continued)

___________________________________________________________Chip Topographies

0.105"

(2.66mm)

0.082"

(2.08mm)

D1

S1

IN1

N.C.

N.C.

N.C.

N.C.

D2

RS

S2

IN2

V-

GND

VL

V+

WR

0.105"

(2.66mm)

0.082"

(2.08mm)

D1

S1

IN1

D3

S3

S4

D4

D2

RS

S2

IN2

V-

GND

VL

V+

WR

DG421

DG423

DG421

DG423/DG425

TRANSISTOR COUNT: 100

SUBSTRATE CONNECTED TO V+

TRANSISTOR COUNT: 100

SUBSTRATE CONNECTED TO V+

PART

TEMP. RANGE

PIN-PACKAGE

DG423CJ

0°C to +70°C

16 Plastic DIP

DG423CY

0°C to +70°C

16 SO

DG423DJ

-40°C to +85°C

16 Plastic DIP

DG423DN

-40°C to +85°C

20 PLCC

DG423AK

-55°C to +125°C

16 CERDIP**

DG425CJ

0°C to +70°C

16 Plastic DIP

DG425CY

0°C to +70°C

16 SO

DG425DJ

-40°C to +85°C

16 Plastic DIP

DG425DN

-40°C to +85°C

20 PLCC

DG425AK

-55°C to +125°C

16 CERDIP**

DG423C/D

0°C to +70°C

Dice*

DG423DY

-40°C to +85°C

16 SO

DG423DK

-40°C to +85°C

16 CERDIP

DG425C/D

0°C to +70°C

Dice*

DG425DY

-40°C to +85°C

16 SO

DG425DK

-40°C to +85°C

16 CERDIP