18.08.2010

uvled365_smd.doc

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Precaution for Use

1. Cautions

• This device is a UV LED, which radiates intense UV light during operation.

• DO NOT look directly into the UV light or look through the optical system. To prevent

inadequate exposure of UV radiation, wearing UV protective glasses is recommended

2. Moisture Proof Package

• When moisture is absorbed into the SMD package, it may vaporize and expand during

soldering. This can cause exfoliation of the contacts, alter the optical characteristics of the

LED, and may irreversible damage the LED.

3. Soldering

• The LEDs should be sodered using the reflow soldering method. Function of the LEDs can

not be guaranteed after assembling was done using dip soldering method

• Recommended soldering conditions:

Reflow Soldering

Dip Soldering

Lead Solder

Lead-free Solder

Pre-Heat

120 …150°C

180 …200°C

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Pre-Heat Time

max 120 s

max 120 s

-

Peak Temperature

240°C

260°C

max 350°C.

Soldering time

max 10 s

max 10 s

max 3 s

Condition

Please see graph below

Please see graph below

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Lead Solder:

Lead free Solder:

Recommended Solder Pad design (unit mm):

• Soldering at the lowest possible temperatures is desireable for the LEDs.

• Occasionally there is a decrease in LEDs brightness due to the influence of heat or ambient

atmoshere during soldering. Nitrogen reflow soldering is recommended therefor.

• LEDs encapsulation material is silicone. Therefor the LEDs surface is soft and must not be

exposed to strong pressure during soldering.