LT3092 datasheet(13/22 Pages) LINER

13 / 22 page

LT3092

3092fb

APPLICATIONS INFORMATION

interface, heat sink resistance or circuit board-to-ambient

as the application dictates. Consider all additional, adjacent

heat generating sources in proximity on the PCB.

Surface mount packages provide the necessary heat

sinking by using the heat spreading capabilities of the

PC board, copper traces and planes. Surface mount heat

sinks, plated through-holes and solder ﬁlled vias can also

spread the heat generated by power devices.

Junction-to-case thermal resistance is speciﬁed from the

IC junction to the bottom of the case directly, or the bottom

of the pin most directly, in the heat path. This is the lowest

thermal resistance path for heat ﬂow. Only proper device

mounting ensures the best possible thermal ﬂow from this

area of the package to the heat sinking material.

Note that the Exposed Pad of the DFN package and the

Tab of the SOT-223 package are electrically connected

to the output (VOUT).

The following tables list thermal resistance as a function

of copper areas in a ﬁxed board size. All measurements

were taken in still air on a four-layer FR-4 board with 1oz

solid internal planes and 2oz external trace planes with a

total ﬁnished board thickness of 1.6mm.

PCB layers, copper weight, board layout and thermal vias

affect the resultant thermal resistance. Please reference

JEDEC standard JESD51-7 for further information on high

thermal conductivity test boards. Achieving low thermal

resistance necessitates attention to detail and careful layout.

Figure 8. Connect Two LT3092s for Higher Current

Figure 9. Parallel Devices

3092 F08

1.33Ω

300Ω

IOUT

IOUT, 300mA

–

LT3092

10μA

–

LT3092

20k

SET

OUT

3092 F09

IOUT

IOUT, 400mA

–

LT3092

10μA

–

LT3092

10μA

2.5Ω

50k

40mΩ*

*40mΩ PC BOARD TRACE

SET

IN MAX

() •

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