19

LTC1419

S

APPLICATI

I FOR ATIO

RD = CONVST

BUSY

CS = 0

1419 F20

(SAMPLE N)

DATA (N – 1)

DB13 TO DB0

DATA

DATA N

DB13 TO DB0

Figure 20. ROM Mode Timing

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

Dimensions in inches (millimeters) unless otherwise noted.

G Package

28-Lead Plastic SSOP (0.209)

(LTC DWG # 05-08-1640)

G28 SSOP 0694

0.005 – 0.009

(0.13 – 0.22)

0

° – 8°

0.022 – 0.037

(0.55 – 0.95)

0.205 – 0.212**

(5.20 – 5.38)

0.301 – 0.311

(7.65 – 7.90)

12 3

4

5

6 7 8

9 10 11 12

14

13

0.397 – 0.407*

(10.07 – 10.33)

25

26

22 21 20 19 18 17 16 15

23

24

27

28

0.068 – 0.078

(1.73 – 1.99)

0.002 – 0.008

(0.05 – 0.21)

0.0256

(0.65)

BSC

0.010 – 0.015

(0.25 – 0.38)

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

*

**