UPD703003 datasheet(78/82 Pages) NEC

78 / 82 page

µPD703003

Data Sheet U12261EJ2V1DS00

18. RECOMMENDED SOLDERING CONDITIONS

The

µPD703003 should be soldered and mounted under the following recommended conditions.

For the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology

Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales represen-

tative.

Table 18-1. Soldering Conditions

Soldering Method

Soldering Conditions

Symbol

Infrared reflow

IR35-107-2

VPS

VP15-107-2

Partial heating

—

Note Exposure limit after dry-pack is opened. Storage conditions: temperature of 25

°C and relative humidity

of 65% or less.

Caution

Do not use different soldering methods together (except for partial heating).

Package peak temperature: 235

°C, Reflow time: 30 seconds or

below (210

°C or higher), Number of reflow processes: 2 max.,

Exposure limit: 7 daysNote (after that, prebaking is necessary at

125

°C for 10 hours)

Package peak temperature: 215

°C, Reflow time: 40 seconds or

below (200

°C or higher), Number of reflow processes: 2 max.,

Exposure limit: 7 daysNote (after that, prebaking is necessary at

125

°C for 10 hours)

Pin temperature: 300

°C or below, Time: 3 seconds or below

(per side of device)

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