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UPD6600AGS Folha de dados(PDF) 32 Page - NEC

Nome de Peças UPD6600AGS
Descrição Electrónicos  4-BIT SINGLE-CHIP MICROCONTROLLER FOR REMOTE CONTROL TRANSMISSION
PDF  36 Pages
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UPD6600AGS Folha de dados(HTML) 32 Page - NEC

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µPD6124A, 6600A
32
25. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
µPD6124A and 6600A be soldered under the following conditions.
For details on the recommended soldering conditions, refer to Information Document “Semiconductor Device
Mounting Technology Manual” (C10535E).
For other soldering methods and conditions, consult NEC.
Table 25-1. Soldering Conditions of Surface-Mount Type
µPD6124AGS-XXX: 20-pin plastic SOP (300 mil)
µPD6600AGS-XXX: 20-pin plastic SOP (300 mil)
Symbol for
Soldering Method
Soldering Conditions
Recommended Condition
Infrared Reflow
Package peak temperature: 230
°C, time: 30 seconds max. (210°C min.), number of times: 1
IR30-00-1
VPS
Package peak temperature: 215
°C, time: 40 seconds max. (200°C min.), number of times: 1
VP15-00-1
Wave Soldering
Soldering bath temperature: 260
°C max., time: 10 seconds max., number of times: 1
Pre-heating temperature: 120
°C max. (package surface temperature)
WS60-00-1
Partial Heating
Pin temperature: 300
°C max., time: 3 seconds max. (per side)
–
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
Table 25-2. Soldering Conditions of Through-Hole Type
µPD6124ACS-XXX: 20-pin plastic shrink DIP (300 mil)
µPD6600ACS-XXX: 20-pin plastic shrink DIP (300 mil)
Soldering Method
Soldering Conditions
Wave Soldering (Only for pin part)
Soldering bath temperature: 260
°C max., time: 10 seconds max.
Partial Heating
Pin temperature: 300
°C max., time: 30 seconds max.
Caution
The wave soldering must be performed at the pin part only. Note that the solder must not be directly
contacted to the package body.



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