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UPD17708 Folha de dados(PDF) 350 Page - NEC

Nome de Peças UPD17708
Descrição Electrónicos  4-BIT SINGLE-CHIP MICROCONTROLLERS WITH DEDICATED HARDWARE FOR DIGITAL TUNING SYSTEM
PDF  356 Pages
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Fabricante Electrônico  NEC [NEC]
Página de início  http://www.nec.com/
Logo NEC - NEC

UPD17708 Folha de dados(HTML) 350 Page - NEC

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µPD17704, 17705, 17707, 17708, 17709
26. RECOMMENDED SOLDERING CONDITIONS
Solder the
µPD17709 under the following recommended conditions.
For the details of the recommended soldering conditions, refer to “Semiconductor Device Mounting Technology
Manual” (C10535E).
For the soldering method and conditions other than those recommended, consult NEC.
Table 26-1. Soldering Conditions of Surface Mount Type
µPD17704GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD17705GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD17707GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD17708GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
µPD17709GC-xxx-3B9: 80-pin plastic QFP (14 × 14 mm, 0.65 mm pitch)
Symbol of
Soldering Method
Soldering Condition
Recommended
Condition
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds MAX. (210 °C MIN.)
IR35-00-2
Number of times: 2 MAX.
VPS
Package peak temperature: 215
°C, Time: 40 seconds MAX. (200 °C MIN.)
VP15-00-2
Number of times: 2 MAX.
Wave soldering
Soldering bath temperature: 260
°C MAX., Time: 10 seconds MAX., Number of times: 1, WS60-00-1
Preheating temperature: 120
°C MAX. (package surface temperature)
Partial heating
Pin temperature: 300
°C MAX., Time: 3 seconds MAX. (per side of device)
—
Caution Do not use two or more soldering methods in combination (except partial heating method).



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