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AN3959 Folha de dados(PDF) 33 Page - STMicroelectronics |
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AN3959 Folha de dados(HTML) 33 Page - STMicroelectronics |
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33 / 65 page ![]() AN3959 Design guidelines for schematic and PCB layout Doc ID 022081 Rev 3 33/65 Thermal dissipation It is mandatory to have a large ground plane on the top layer, inner layer2, inner layer3, and bottom layer and solder the slug on the PCB. Figure 36. Large ground plane on the top side Figure 37. Large ground plane on inner layer2 |
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