SSM2211_15 datasheet(20/24 Pages) AD

20 / 24 page

SSM2211

Data Sheet

Rev. F | Page 20 of 24

The polarity of the speakers is important because each output is

180° out of phase with the other. By connecting the negative

terminal of Speaker 1 to Pin 5 and the positive terminal of

Speaker 2 to Pin 8, proper speaker phase can be established.

The maximum power dissipation of the device, assuming both

loads are equal, can be found by doubling Equation 11. If the

loads are different, use Equation 11 to find the power dissipa-

tion caused by each load, and then take the sum to find the total

power dissipated by the SSM2211.

LFCSP PCB CONSIDERATIONS

The LFCSP is a plastic encapsulated package with a copper lead

frame substrate. This is a leadless package with solder lands on

the bottom surface of the package, instead of conventional

formed perimeter leads. A key feature that allows the user to

reach the quoted θJA performance is the exposed die attach

paddle (DAP) on the bottom surface of the package. When

soldered to the PCB, the DAP can provide efficient conduction

of heat from the die to the PCB. To achieve optimum package

performance, consideration should be given to the PCB pad

design for both the solder lands and the DAP. For further

information, the user is directed to the Amkor Technology

document, Application Notes for Surface Mount Assembly of

Amkor’s MicroLead Frame (MLF) Packages. This can be

downloaded from the Amkor Technology website.

SSM2211 Folha de dados(PDF) 20 Page - Analog Devices