5

RECOMMENDED SOLDERING CONDTITIONS

The following conditions (see table below) must be met then soldering this product. Please consult with our sales

offices in case other soldering process is used, or in case soldering is done under different contions.

TYPES OF SURFACE MOUNT DEVICE

For more details, refer to our document “SMT MANUAL” (IEI-1207).

NE68039 / 2SC4095

lo

b

m

y

S

s

n

oi

ti

d

n

o

c

g

ni

r

e

dl

o

S

s

s

e

c

o

r

p

g

ni

r

e

dl

o

S

Infrared ray reflow

Peak packageʼs surface temperature: 230 C or below,

Reflow time:

30 seconds or below (210 C or higher),

Number of reflow process:

1, Exposure limit*: None

IR30-00-1

5

1

2

:

e

r

u

t

a

r

e

p

m

e

t

e

c

a

fr

u

s

sʼ

e

g

a

k

c

a

p

k

a

e

P

S

P

V

C or below,

Reflow time:

40 seconds or below (200 C or higher),

Number of reflow process:

1, Exposure limit*: None

VP15-00-1

Wave soldering

Solder temperature:

260 C or below,

Flow time:

10 seconds or below,

Number of reflow process:

1, Exposure limit*: None

WS60-00-1

Partial heating method

Terminal temperature:

300 C or below,

Flow time:

3 seconds or below,

Exposure limit*:

None

*: Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25 C and relative humidity at 65 % or less.

Note: Do not apply more than a single process at once, except for “Partial heating method”.

NE68039 / 2SC4095