| Os motores de busca de Datasheet de Componentes eletrônicos |
|
ASF130 Folha de dados(PDF) 8 Page - Advanced Semiconductor Business Inc. |
|
|
|||||||||||||||||||||||||||||
ASF130 Folha de dados(HTML) 8 Page - Advanced Semiconductor Business Inc. |
|
8 / 9 page ![]() 8/9 ASB Inc. sales@asb.co.kr July 2014 ASF130 4. Package Outline (SOT363, 2.1x2.0x1.0 mm) 5. Surface Mount Recommendation (In mm) 1.48 0.30 0.42 0.50 1.23 0.30 Symbols Dimensions (In mm) MIN NOM MAX A 0.900 1.000 1.10 A1 0.025 0.062 0.10 A2 0.875 0.937 1.00 b 0.200 0.300 0.40 C 0.100 0.125 0.15 D 1.900 2.000 2.10 F 1.150 1.250 1.35 E1 2.000 2.100 2.20 e 0.65BSC e1 1.30BSC L 0.425REF NOTE 1. The number and size of ground via holes in a circuit board are critical for thermal and RF grounding considerations. 2. Recommend is that the ground via holes be placed on the bottom of the ground leads and exposed pad of the device for better RF and thermal performance, as shown in the drawing at the left side. |
|
|
Ligação URL |
| ALLDATASHEET é útil para você? [ DONATE ] |
Sobre Alldatasheet | Publicidade | Contato conosco | Privacy Policy | Link para a ficha técnica | roca de Link | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |