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mmPC2745TB, mmPC2746TB

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All

the ground pins must be connected together with wide ground pattern to decrease impedance difference.

(4) The DC cut capacitor must be each attached to input and output pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions.

Other soldering methods and

conditions than the recommended conditions are to be consulted with our sales representatives.

mmPC2745TB, mmPC2746TB

Soldering method

Soldering conditions

Recommended condition symbol

Infrared ray

reflow

Package peak temperature : 235

°C, Hour : within 30 s. (more than 210

°C) Time : 3 times, Limited days : no.*

IR35-00-3

VPS

Package peak temperature : 215

°C, Hour : within 40 s. (more than 200

°C) Time : 3 times, Limited days : no.*

VP15-00-3

Wave soldering

Soldering tub temperature : less than 260

°C, Hour : within 10 s.

Time : 1 times, Limited days : no.*

WS60-00-1

Pin part heating

Pin area temperature : 300

°C, Hour : within 3 s/pin.

Limited days : no.*

* It is the storage days after opening a dry pack, the storage conditions are 25

°C, less than 65 % RH.

Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).