AD9020

–4–

REV. C

ORDERING GUIDE

Temperature

Package

Device

Range

Description

Option

*

AD9020JZ

0

°C to 70°C

68-Lead Leaded Ceramic

Z-68

AD9020JE

0

°C to 70°C

68-Terminal Ceramic LCC E-68A

AD9020KZ

0

°C to 70°C

68-Lead Leaded Ceramic

Z-68

AD9020KE

0

°C to 70°C

68-Terminal Ceramic LCC E-68A

AD9020SZ/883 –55

°C to +125°C 68-Lead Leaded Ceramic

Z-68

AD9020SE/883 –55

°C to +125°C 68-Terminal Ceramic LCC E-68A

AD9020TZ/883 –55

°C to +125°C 68-Lead Leaded Ceramic

Z-68

AD9020TE/883 –55

°C to +125°C 68-Terminal Ceramic LCC E-68A

AD9020/PCB

0

°C to 70°C

Evaluation Board

*E = Ceramic Leadless Chip Carrier; Z = Ceramic Leaded Chip Carrier.

DIE LAYOUT AND MECHANICAL INFORMATION

Die Dimensions . . . . . . . . . . . . . . . 206

140

15 (

±2) mils

Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

4 mils

Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold

Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None

Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride

LSBs INVERT

OVERFLOW

ENCODE

GROUND

GROUND

GROUND

46

51

AD9020

12

56

14

ANALOG IN

MSB INVERT

LSBs INVERT

GROUND

ENCODE

3,6,15,18,25,30,33,34,

37,40,45,52,55,65,68

2,16,28,29,35,

41,42,54,64

4,5,13,17,

27,31,32,

36,38,39,

43,53,66,67

510

510

510

100

+2V

–2V

AD2

AD1

5.0V

–5.2V

0.1 F

0.1 F

STATIC: AD1 = –2V; AD2 = +2.4V

DYNAMIC: AD1 =

2V TRIANGLE WAVE

AD2 = TTL PULSE TRAIN

61

59

19

23

8

9

Figure 1. Burn-In Circuit

EXPLANATION OF TEST LEVELS

Test Level

I

– 100% production tested.

II – 100% production tested at 25

°C, and sample tested at

specified temperatures.

III – Sample tested only.

IV – Parameter is guaranteed by design and characterization

testing.

V

– Parameter is a typical value only.

VI – All devices are 100% production tested at 25

°C. 100%

production tested at temperature extremes for extended

temperature devices; sample tested at temperature extremes

for commercial/industrial devices.