AS87196CB datasheet(3/33 Pages) INTEL

3 / 33 page

87C196CA87C196CB

PROCESS INFORMATION

These devices are manufactured on P6295

CHMOS III-E process Additional process and reli-

ability information is available in Intel’s

Components

Quality and Reliability Handbook

Order Number

210997

All thermal impedance data is approximate for static

air conditions at 10W of power dissipation Values

will change depending on operation conditions and

application See the Intel

Packaging Handbook (or-

der number 240800) for a description of Intel’s ther-

mal impedance test methodology

272405 – 2

Figure 2 The 87C196CACB Familiy Nomenclature

Thermal Characteristics

Device and Package

iJA

iJC

AN87C196CB

350 CW

110 CW

(84-Lead PLCC Package)

AN87C196CA

365 CW

100 CW

(68-Lead PLCC Package)

NOTES

1 iJA e Thermal resistance between junction and the surrounding environment (ambient) measurements are taken 1 ft

away from case in air flow environment

iJC e Thermal resistance between junction and package face (case)

2 All values of iJA and iJC may fluctuate depending on the environment (with or without airflow and how much airflow)

and device power dissipation at temperature of operation Typical variations are g2 CW

3 Values listed are at a maximum power dissipation of 10W

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