1-527

0.51 (0.020)

MIN.

5.57 (0.180)

MAX.

0.51 (0.020)

MAX.

2.29 (0.090)

2.79 (0.110)

1.40 (0.055)

1.65 (0.065)

9.65 (0.380)

9.91 (0.390)

5° MAX.

5.57 (0.180)

MAX.

0.20 (0.008)

0.33 (0.013)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

Leadless Device Marking

Leaded Device Marking

Hermetic Optocoupler Options

Option

Description

100

Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for

details).

200

Lead finish is solder dipped rather than gold plated. This option is available on commercial

and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead

finish. All leadless chip carrier devices are delivered with solder dipped terminals as a

standard feature.

300

Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for

details). This option has solder dipped leads.

1.14 (0.045)

1.40 (0.055)

4.32 (0.170)

MAX.

0.51 (0.020)

MAX.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MIN.

7.36 (0.290)

7.87 (0.310)

0.20 (0.008)

0.33 (0.013)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

HP QYYWWZ

XXXXXX

XXXXXXX

XXX USA

* 50434

COUNTRY OF MFR.

HP FSCN*

HP LOGO

DESC SMD*

PIN ONE/

ESD IDENT

HP P/N

DESC SMD*

* QUALIFIED PARTS ONLY

COMPLIANCE INDICATOR,*

DATE CODE, SUFFIX (IF NEEDED)

HP QYYWWZ

XXXXXX

* XXXX

XXXXXX

USA 50434

DESC SMD*

HP FSCN*

HP LOGO

COUNTRY OF MFR.

HP P/N

PIN ONE/

ESD IDENT

DESC SMD*

* QUALIFIED PARTS ONLY