NUMBER

DESCRIPTION

RANGE

FLOW

IN

FINISH

HI-8382C

16 PIN CERAMIC SIDE BRAZED DIP

-40°C TO +85°C

I

NO

GOLD

HI-8382CT

16 PIN CERAMIC SIDE BRAZED DIP

-55°C TO +125°C

T

NO

GOLD

HI-8382CM-01 16 PIN CERAMIC SIDE BRAZED DIP

-55°C TO +125°C

M

YES

SOLDER

HI-8382CM-03* 16 PIN CERAMIC SIDE BRAZED DIP

-55°C TO +125°C

DSCC

YES

SOLDER

HI-8382J

28 PIN PLASTIC J -LEAD PLCC

-40°C TO +85°C

I

NO

SOLDER

HI-8382JT

28 PIN PLASTIC J -LEAD PLCC

-55°C TO +125°C

T

NO

SOLDER

HI-8382S

28 PIN CERAMIC LEADLESS CHIP CARRIER

-40°C TO +85°C

I

NO

GOLD

HI-8382ST

28 PIN CERAMIC LEADLESS CHIP CARRIER

-55°C TO +125°C

T

NO

GOLD

HI-8382SM-01

28 PIN CERAMIC LEADLESS CHIP CARRIER

-55°C TO +125°C

M

YES

SOLDER

HI-8382U

32 PIN J-LEAD CERQUAD

-40°C TO +85°C

I

NO

SOLDER

HI-8382UT

32 PIN J-LEAD CERQUAD

-55°C TO +125°C

T

NO

SOLDER

HI-8382, HI-8383

HI-8383 part numbers identical except the SMD version is not available.

SUPPLY CURRENT (mA )

2

JUNCTION TEMP, Tj (°C)

Ta = 25

Ta = 85

Ta=125

Ta = 25

Ta = 85

Ta=125

Low Speed

3

17.6

17.2

17.0

48

107

142

High Speed

4

25.4

24.5

24.2

56

110

150

Low Speed

17.9

17.4

17.1

41

103

145

High Speed

25.8

24.8

24.4

47

112

147

SUPPLY CURRENT (mA )

2

JUNCTION TEMP, Tj (°C)

Ta = 25

Ta = 85

Ta=125

Ta = 25

Ta = 85

Ta=125

Low Speed

3

60.1

55.7

52.4

110

157

194

High Speed

4

63.1

56.3

52.3

100

150

182

Low Speed

62.1

56.2

53.0

90

145

180

High Speed

64.0

56.2

52.2

86

144

176

16 Lead Ceramic SB DIP

PACKAGE STYLE

1

16 Lead Ceramic SB DIP

M AXIMUM AR INC LOAD

7

5 , 6, 7

ARINC 429

DATA RATE

ARINC 429

DATA RATE

PACKAGE STYLE

1

28 Lea d PLCC

28 Lea d PLCC

Notes:

1. All data taken

on devices soldered toa single layer copper PCB (3"X 4.5"X .062").

2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.

3. Low Speed: Data Rate= 12.5 Kbps, Load:R= 400 Ohms,C= 30 nF.

4. High Speed: Data Rate= 100 Kbps, Load:R= 400 Ohms,C= 10 nF. Data not presented forC= 30

as this is considered unrealistic for high speed operation.

5. Similar results would be obtained with A

shorted to B

.

6. For applications requiring survival with continuous short circuit, operation above Tj= 175°C is not recommended.

7. Data will vary depending on air flow and the method of heat sinking employed.

in still air

OUT

OUT

HI-8382 PACKAGE THERMAL CHARACTERISTICS

HOLT INTEGRATED CIRCUITS

5