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TL431 Folha de dados(PDF) 7 Page - Compact Technology Corp. |
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TL431 Folha de dados(HTML) 7 Page - Compact Technology Corp. |
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7 / 7 page ![]() Soldering Methods for CTC Products 1. Storage environment: Temperature=10 oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) <3 oC/sec <3 oC/sec Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) 100 oC 150 oC 60~120 sec 150 oC 200 oC 60~180 sec Tsmax to TL - Ramp-up Rate <3 oC/sec <3 oC/sec Time maintained above: - Temperature (TL) - Time (tL) 183 oC 60~150 sec 217 oC 60~150 sec Peak Temperature (TP) 240 oC +0/-5oC 260 oC +0/-5oC Time within 5 oC of actual Peak Temperature (tP) 10~30 sec 20~40 sec Ramp-down Rate <6 oC/sec <6 oC/sec Time 25 oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245 oC 5oC 5sec 1sec Pb-Free devices. 260 oC +0/-5oC 5sec 1sec Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP 25 t 25oC to Peak Time TL431 Series CTC-IC-0002-VER2.0 7/7 TL431 |
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