SMC30J

Characteristics

Doc ID 022064 Rev 1

5/10

Figure 11.

Leakage current versus junction temperature (typical values)

Figure 9.

Relative variation of thermal

impedance, junction to ambient,

versus pulse duration

Figure 10. Thermal resistance junction to

ambient versus copper surface

under each lead

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

t (s)

p

Recommended pad layout

Single pulse

Z/R

th(j-a)

th(j-a)

epoxy printed board, FR4 copper thickness = 35 µm

0

10

20

30

40

50

60

70

80

90

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S (cm )

Cu

2

epoxy printed board, FR4 copper thickness = 35 µm

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

25

50

75

100

125

150

I (nA)

R

V= V

RRM

V

< 10 V

RM

V10 V

T (°C)

j