2.

Qualify improved mold compound to achieve better moisture sensitivity level (from MSL 4 to MSL 3)

and

3.

Qualify new leadframe base material to improve matching of coefficient of thermal expansion

Parts Affected:

HFBR-2505CFZ

HFBR-2505CZ

HFBR-2521Z

HFBR-2522Z

HFBR-2523Z

HFBR-2523Z-00A

HFBR-2524Z

HFBR-2531Z

HFBR-2532Z

HFBR-2533Z

HFBR-2541Z

QFBR-2548Z

QFBR-2551Z

QFBR-2573Z

QFBR-521RZ

QFBR-R521Z

QFBR-R531Z

QFBR-TR04Z

QFBR-TR05Z

QFBR-TR10Z

QFBR-5591Z

QFBR-5592Z

QFBR-5594Z

QFBR-5595Z

4.

Qualify alternate photo diode supplier and improved mold compound:

Parts Affected:

QFBR-R518Z

HFBR-2510Z

HFBR-2526Z

HFBR-2536Z

Reasons for Changes:

1.

Improved mold compound:

to improve moisture sensitivity level from MSL 4 to MSL 3 and to harmonize the mold compound in use.

The improved mold compound has been qualified and used in other Avago products since 2007.

2.

New leadframe base material:

to improve the matching of coefficient-of-thermal-expansion. Lead frame layout remains unchanged. All

other 650nm transmitters from Avago have been qualified and shipped with this lead frame material for

more than 15 years.

3.

New photodiode:

to qualify alternative photo diode supplier. The alternate supplier and its photo diode is already qualified

and used in other Avago products since 2007.

Effect of Change on Fit, Form, Function, Quality or Reliability:

Reliability qualifications have been performed to ensure product reliability before the implementation date.

Detailed product characterizations were performed to ensure product compliance to datasheet.