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GP20D Folha de dados(PDF) 1 Page - General Semiconductor |
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GP20D Folha de dados(HTML) 1 Page - General Semiconductor |
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1 / 2 page  GP20A THRU GP20J GLASS PASSIVATED JUNCTION RECTIFIER Reverse Voltage - 50 to 600 Volts Forward Current - 2.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ 2.0 Ampere operation at TA= 55°C with no thermal runaway ♦ Typical IR less than 0.1µA ♦ High temperature soldering guaranteed: 350°C/10 seconds 0.375" (9.5mm) lead length, 5 lbs.(2.3kg) tension MECHANICAL DATA Case: Molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Band denotes cathode end Mounting Position: Any Weight: 0.03 ounce, 0.8 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. GP GP GP GP GP SYMBOLS 20A 20B 20D 20G 20J UNITS Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 Volts Maximum RMS voltage VRMS 35 70 140 280 420 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55°C I(AV) 2.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 65.0 Amps Maximum instantaneous forward voltage at 2.0A VF 1.2 1.1 Volts Maximum reverse current at rated DC blocking voltage IR 5.0 µA Maximum full load reverse current, full cycle average 0 375" (9.5mm) lead length at TA=55°C IR(AV) 100.0 µA Typical reverse recovery time (NOTE 1) trr 2.5 µs Typical junction capacitance (NOTE 2) CJ 40.0 pF Typical thermal resistance (NOTE 3) R ΘJA 25.0 °C/W R ΘJL 10.0 Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length P.C.B. mounted 4/98 0.210 (5.3) 0.190 (4.8) DIA. 0.042 (1.07) 0.037 (0.94) DIA. 1.0 (25.4) MIN. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) MIN. Case Style GP20 Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306 ® |
Nº de peça semelhante - GP20D |
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Descrição semelhante - GP20D |
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