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LP38859 Folha de dados(PDF) 13 Page - Texas Instruments |
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LP38859 Folha de dados(HTML) 13 Page - Texas Instruments |
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13 / 21 page ![]() LP38859 www.ti.com SNVS337D – JUNE 2006 – REVISED OCTOBER 2011 Figure 28. θJA vs Copper (1 Ounce) Area for the DDPAK/TO-263 package Figure 28 shows that increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θJA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W. Figure 29 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C. Figure 29. Maximum power dissipation vs ambient temperature for the DDPAK/TO-263 package Copyright © 2006–2011, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: LP38859 |
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