LM2621 datasheet(2/16 Pages) TI1

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LM2621

SNVS033C – MAY 2004 – REVISED MARCH 2005

www.ti.com

Connection Diagram

Mini SO-8 (MM) Package

Figure 1. Top View

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

SW Pin Voltage

−0.5 V to 14.5V

BOOT, VDD, EN and FB Pins

−0.5V to 10V

FREQ Pin

100µA

θJA

(2)

240°C/W

TJmax

(2)

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temp. (Soldering, 5 sec)

260°C

Power Dissipation (TA=25°C)

(2)

500mW

ESD Rating (3)

2kV

(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device outside of its rated operating conditions.

(2)

The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature),

θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any

temperature is Pdmax = (Tjmax - TA)/ θJA or the number given in the Absolute Maximum Ratings, whichever is lower.

(3)

The human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. For Pin 8 (SW) the ESD rating is 1.5

kV.

Operating Conditions

(1)

VDD Pin

2.5V to 5V

FB, EN Pins

0 to VDD

BOOT Pin

0 to 10V

Ambient Temperature (TA)

−40°C to +85°C

(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device outside of its rated operating conditions.

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