Datasheet

BMM150 Geomagnetic Sensor

Page 5

BST-BMM150-DS001-01 | Revision 1.0 | April 2013

Bosch Sensortec

© Bosch Sensortec GmbH reserves all rights even in the event of industrial property rights. We reserve all rights of disposal such as copying and passing on to

third parties. BOSCH and the symbol are registered trademarks of Robert Bosch GmbH, Germany.

Note: Specifications within this document are subject to change without notice.

6. DIGITAL INTERFACES............................................................................................................32

6.1 SERIAL PERIPHERAL INTERFACE (SPI)................................................................................ 33

6.2 INTER-INTEGRATED CIRCUIT (I²C) ...................................................................................... 36

7. PIN-OUT AND CONNECTION DIAGRAM...............................................................................41

7.1 PIN-OUT ........................................................................................................................... 41

7.2 CONNECTION DIAGRAM 4-WIRE SPI ................................................................................... 42

7.3 CONNECTION DIAGRAM 3-WIRE SPI ................................................................................... 43

7.4 CONNECTION DIAGRAM I2C................................................................................................ 44

8. PACKAGE ................................................................................................................................45

8.1 OUTLINE DIMENSIONS ....................................................................................................... 45

8.2 SENSING AXES ORIENTATION ............................................................................................. 46

9. SENSOR ORIENTATION .........................................................................................................46

9.1 ANDROID AXES ORIENTATION............................................................................................. 47

9.2 LANDING PATTERN RECOMMENDATION ............................................................................... 48

9.3 MARKING.......................................................................................................................... 49

9.3.1 MASS PRODUCTION DEVICES ........................................................................................................ 49

9.3.2 ENGINEERING SAMPLES................................................................................................................ 50

9.4 SOLDERING GUIDELINES.................................................................................................... 51

9.5 HANDLING INSTRUCTIONS.................................................................................................. 52

9.5.1 TAPE AND REEL DIMENSIONS......................................................................................................... 53

9.5.2 ORIENTATION WITHIN THE REEL..................................................................................................... 53

9.6 ENVIRONMENTAL SAFETY .................................................................................................. 54

9.6.1 HALOGEN CONTENT ..................................................................................................................... 54

9.6.2 INTERNAL PACKAGE STRUCTURE ................................................................................................... 54

10. LEGAL DISCLAIMER.............................................................................................................55

10.1 ENGINEERING SAMPLES................................................................................................... 55

10.2 PRODUCT USE ................................................................................................................ 55

10.3 APPLICATION EXAMPLES AND HINTS ................................................................................. 55

11. DOCUMENT HISTORY AND MODIFICATION .....................................................................56