Preliminary Data Sheet P13865EJ1V0DS00

13

2SC5508

SOLDERING CONDITIONS

Solder this product under the following recommended conditions.

For soldering methods and conditions other than those recommended, consult NEC.

Soldering Method(s)

Soldering Conditions

Recommended Conditions Symbol

Infrared reflow

Package peak temperature: 235 °C, Time: 30 sec max. (210 °C min.),

Number of times: twice max., Maximum number of days: None

Note

IR35-00-2

VPS

Package peak temperature: 215 °C, Time: 40 sec max. (200 °C min.),

Number of times: twice max., Maximum number of days: None

Note

VP15-00-2

Wave soldering

Solder bath temperature: 260 °C, Time: 10 sec max., Number of

times: once, Maximum number of days: None

Note

WS60-00-1

Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25 °C,

65% RH MAX.

Caution Do not use two or more soldering methods in combination.

For details of the recommended soldering conditions, refer to information document Semiconductor Device

Mounting Technology Manual (C10535E).