M24C08 datasheet(28/34 Pages) STMICROELECTRONICS

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Package mechanical data

M24C01/02-W M24C01/02-R M24C02-F

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DocID024020 Rev 2

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 12. TSSOP8 – 8-lead thin shrink small outline, package outline

1. Drawing is not to scale.

Table 18. TSSOP8 – 8-lead thin shrink small outline, package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ.

Min.

Max.

Typ.

Min.

Max.

–

1.200

–

0.0472

–

0.050

0.150

–

0.0020

0.0059

1.000

0.800

1.050

0.0394

0.0315

0.0413

–

0.190

0.300

–

0.0075

0.0118

–

0.090

0.200

–

0.0035

0.0079

–

0.100

–

0.0039

3.000

2.900

3.100

0.1181

0.1142

0.1220

0.650

–

0.0256

–

6.400

6.200

6.600

0.2520

0.2441

0.2598

4.400

4.300

4.500

0.1732

0.1693

0.1772

0.600

0.450

0.750

0.0236

0.0177

0.0295

1.000

–

0.0394

–

0°

8°

–

0°

8°

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