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STPS1L60 Folha de dados(PDF) 6 Page - STMicroelectronics |
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STPS1L60 Folha de dados(HTML) 6 Page - STMicroelectronics |
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6 / 10 page ![]() Characteristics STPS1L60 6/10 Doc ID 7504 Rev 8 Figure 19. Thermal resistance junction to ambient versus copper surface under tab (STmite flat) Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Figure 18. Thermal resistance versus lead length (DO-41) 0 20 40 60 80 100 120 140 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMA Scu(cm²) Rth(j-a)(°C/W) Epoxy printed circuit board FR4 copper thickness = 35 µm 0 20 40 60 80 100 120 510 15 20 Lleads(mm) 25 Rth(°C/W) DO-41 Rth(j-a) Rth(j-l) 0 25 50 75 100 125 150 175 200 225 250 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STmite flat Rth(j-a)(°C/W) Scu(cm²) Epoxy printed circuit board FR4 copper thickness = 35 µm |
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