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L6208PD Folha de dados(PDF) 28 Page - STMicroelectronics |
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L6208PD Folha de dados(HTML) 28 Page - STMicroelectronics |
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28 / 35 page ![]() Application information L6208 28/35 DocID7514 Rev 2 Figure 31. PowerDIP24 junction ambient thermal resistance versus on-board copper area Figure 32. SO24 junction ambient thermal resistance versus on-board copper area Figure 33. Mounting the PowerSO package Slug soldered to PCB with dissipating area Slug soldered to PCB with dissipating area plus ground layer Slug soldered to PCB with dissipating area plus ground layer contacted through via holes |
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