THS7530

SLOS405C – DECEMBER 2002 – REVISED FEBRUARY 2010

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PART NUMBER

PACKAGE TYPE

PACKAGE MARKING

TRANSPORT MEDIA, QUANTITY

THS7530PWP

Rails, 90

TSSOP-14-PP

THS7530

THS7530PWPR

Tape and Reel, 2000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

THS7530

Supply voltage

5.5 V

Input voltage

Output current

65 mA

Differential input voltage

±4 V

Continuous power dissipation

See Dissipation Rating Table

Maximum junction temperature

+150°C

+125°C

Storage temperature range

–65°C to +150°C

HBM

3000 V

ESD

CDM

1500 V

MM

200 V

(1)

The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may

cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(2)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

PACKAGE THERMAL DATA

PACKAGE

PCB

(°C/W)

See Layout Considerations in the Application section of this data sheet.

37.5

2.07

3 W

(1)

This data was taken using the JEDEC High-K test printed circuit board (PCB).

(2)

This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 in x 3 in PCB.

(3)

The THS7530 incorporates a PowerPAD™ on the underside of the chip. This acts as a heatsink and must be connected to a thermally

dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could

permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about using the PowerPAD

thermally enhanced package.

RECOMMENDED OPERATING CONDITIONS

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Supply voltage

4.5

5

5.5

V

Operating free-air temperature

–40

+85

°C

Input common mode voltage

2.5

V

Output common mode voltage

2.5

V

2

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