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PIC16F7XESSQTP Folha de dados(PDF) 162 Page - Microchip Technology

Nome de Peças PIC16F7XESSQTP
Descrição Electrónicos  28/40-pin, 8-bit CMOS FLASH Microcontrollers
PDF  174 Pages
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Fabricante Electrônico  MICROCHIP [Microchip Technology]
Página de início  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16F7XESSQTP Folha de dados(HTML) 162 Page - Microchip Technology

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PIC16F7X
DS30325B-page 160
 2002 Microchip Technology Inc.
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
CH2 x 45
°
CH1 x 45
°
10
5
0
10
5
0
β
Mold Draft Angle Bottom
10
5
0
10
5
0
α
Mold Draft Angle Top
0.53
0.51
0.33
.021
.020
.013
B
0.81
0.74
0.66
.032
.029
.026
B1
Upper Lead Width
0.33
0.27
0.20
.013
.011
.008
c
Lead Thickness
11
11
n1
Pins per Side
16.00
15.75
14.99
.630
.620
.590
D2
Footprint Length
16.00
15.75
14.99
.630
.620
.590
E2
Footprint Width
16.66
16.59
16.51
.656
.653
.650
D1
Molded Package Length
16.66
16.59
16.51
.656
.653
.650
E1
Molded Package Width
17.65
17.53
17.40
.695
.690
.685
D
Overall Length
17.65
17.53
17.40
.695
.690
.685
E
Overall Width
0.25
0.13
0.00
.010
.005
.000
CH2
Corner Chamfer (others)
1.27
1.14
1.02
.050
.045
.040
CH1
Corner Chamfer 1
0.86
0.74
0.61
.034
.029
.024
A3
Side 1 Chamfer Height
0.51
.020
A1
Standoff
§
A2
Molded Package Thickness
4.57
4.39
4.19
.180
.173
.165
A
Overall Height
1.27
.050
p
Pitch
44
44
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
β
A2
c
E2
2
D
D1
n
#leads=n1
E
E1
1
α
p
A3
A
35
°
B1
B
D2
A1
.145
.153
.160
3.68
3.87
4.06
.028
.035
0.71
0.89
Lower Lead Width
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
§ Significant Characteristic



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