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PIC16F7XESSQTP Folha de dados(PDF) 159 Page - Microchip Technology |
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PIC16F7XESSQTP Folha de dados(HTML) 159 Page - Microchip Technology |
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159 / 174 page ![]() 2002 Microchip Technology Inc. DS30325B-page 157 PIC16F7X 28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) (Continued) Pad Width *Controlling Parameter Drawing No. C04-2114 B .009.011 .0140.230.28 0.35 Pitch MAX Units Dimension Limits p INCHES .026 BSC MIN NOM MAX MILLIMETERS* MIN 0.65 BSC NOM Pad Length Pad to Solder Mask L .020 .024 .030 0.50 0.60 0.75 M.005 .006 0.13 0.15 L p M M B PACKAGE EDGE SOLDER MASK |
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