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AS3543 Folha de dados(PDF) 11 Page - ams AG |
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AS3543 Folha de dados(HTML) 11 Page - ams AG |
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11 / 92 page ![]() www.austriamicrosystems.com Revision 1.11 10 - 91 AS3543 3v2 Data Sheet - A b s o l u t e M a x i m u m R a t i n g s Bump Temperature (soldering) Package Body Temperature 260 °C Norm IPC/JEDEC J-STD-020C, reflects moisture sensitivity level only Solder Profile 235 245 °C peak temperature 30 45 s well time above 217 °C Moisture Sensitive Level 3 1 Represents a max. floor live time of 168h 1. Depending on actual PCB layout and PCB used Table 3. Absolute Maximum Ratings Parameter Min Max Units Comments |
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