PIC16C71 datasheet(184/337 Pages) MICROCHIP

184 / 337 page

PIC16C6X

DS30234D-page 184

Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67

18.1

DC Characteristics:

PIC16C62/64-04 (Commercial, Industrial)

PIC16C62/64-10 (Commercial, Industrial)

PIC16C62/64-20 (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40˚C

≤ TA ≤ +85˚C for industrial and

0˚C

≤ TA ≤ +70˚C for commercial

Param

No.

Characteristic

Sym

Min

Typ† Max Units

Conditions

D001

D001A

Supply Voltage

VDD

4.0

4.5

6.0

5.5

XT, RC and LP osc conﬁguration

HS osc conﬁguration

D002*

RAM Data Retention

Voltage (Note 1)

VDR

1.5

D003

VDD start voltage to

ensure internal Power-

on Reset signal

VPOR

-VSS

See section on Power-on Reset for details

D004*

VDD rise rate to ensure

internal Power-on

Reset signal

SVDD

0.05

V/ms See section on Power-on Reset for details

D010

D013

Supply Current

(Note 2, 5)

IDD

2.7

13.5

5.0

XT, RC, osc conﬁguration

FOSC = 4 MHz, VDD = 5.5V (Note 4)

HS osc conﬁguration

FOSC = 20 MHz, VDD = 5.5V

D020

D021

D021A

Power-down Current

(Note 3, 5)

IPD

10.5

1.5

µA

VDD = 4.0V, WDT enabled, -40

°C to +85°C

VDD = 4.0V, WDT disabled, -0

°C to +70°C

VDD = 4.0V, WDT disabled, -40

°C to +85°C

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD

MCLR = VDD; WDT enabled/disabled as speciﬁed.

3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is

measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc conﬁguration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula Ir = VDD/2Rext (mA) with Rext in kOhm.

5: Timer1 oscillator (when enabled) adds approximately 20

µA to the speciﬁcation. This value is from charac-

terization and is for design guidance only. This is not tested.

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