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AS1376

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only and functional operation of

the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

VIN to GND

-0.3

5

V

VBIAS, EN to GND

-0.3

+6.5

V

VOUT to GND

-0.3

V

Output Short-Circuit Duration

Indefinite

Input Current (latch-up immunity)

-100

100

mA

JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

2

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Thermal Resistance

97

ºC/W

Junction-to-ambient thermal resistance is very

dependent on application and board-layout. In

situations where high maximum power

dissipation exists, special attention must be paid

to thermal dissipation during board design.

Junction Temperature

+125

ºC

Storage Temperature Range

-55

+150

ºC

Humidity non-condensing

5

85

%

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity non-condensing

5

85

%